Hoʻokaʻawale ʻana: ʻĀpana Kokua KimiaCAS No.:9004-65-3Nā inoa ʻē aʻe: HPMCMF: C18H38O14EINECS Helu.:C18H38O14Maʻemaʻe: 99.9%Kahi i kumu: Hebei, KinaʻAno: Wall Putty A me Tile Adhesive AdditiveHoʻohana: Coating Auxiliary Agents, Construction